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Technical Specs
Instrument Type
TEM

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Built on Engineering Excellence

High Impact Publications

William A. Hubbard, Jared J. Lodico, Ho Leung Chan, Matthew Mecklenburg, B. C. Regan. “Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC”. (2022)

William A. Hubbard, Jared J. Lodico, Ho Leung Chan, Matthew Mecklenburg, Brian C. Regan. “Imaging Dielectric Breakdown in Valence Change Memory”. Advanced Functional Materials (2022)

William A. Hubbard, Jared J. Lodico, Xin Yi Ling, Brian T. Zutter, Young-Sang Yu, David A. Shapiro, B.C. Regan. “Differential electron yield imaging with STXM”. Ultramicroscopy (2021)

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