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TEM MEMS Heating + Biasing

Operando heating, biasing under environmental conditions

High-Temperature Heating and Biasing Inside the TEM

The Hummingbird Scientific TEM MEMS Heating + Biasing sample holder enables researchers to heat and electrically bias samples inside the TEM while directly imaging structural, chemical, and electrical changes at the nanoscale. The platform combines MEMS heating chips, on-chip temperature sensing, electrical biasing contacts, and single- or double-tilt configurations for operando materials and device research. Hummingbird Scientific designs, fabricates, and tests its MEMS chips in-house, integrating holder design, chip development, controller technology, applications support, and service within a unified platform.

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Designed for Operando Materials and Device Research

The system supports phase transformations, nanoscale diffusion, electrical transport studies, semiconductor and phase-change materials, 2D materials, catalysts, nanoparticles, thin films, and failure analysis where temperature, bias, structure, and chemistry must be observed simultaneously.

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Observe the Mechanisms Behind Material and Device Behavior

By correlating temperature, electrical stimulus, real-time imaging, and analytical signals inside the TEM, researchers can directly observe the mechanisms that drive material transformation, device performance, and failure.

Technical Specs
Single-Tilt
Double-Tilt
Tilt Range
Up to ±45° depending on objective pole
<0.01 degree
Beta-Tilt Accuracy
N/A
Up to ±20° alpha and beta depending on objective pole
Electrical Contacts
9
9
Contact Type
Direct chip contact
Direct chip contact
Max Operating Temperature
>1000 °C
>1000 °C
Settled Resolution at 1000 °C
Up to TEM resolution
Up to TEM resolution
Temperature Stability
>100 hours
>100 hours
Temperature Measurement
4-point resistance sensing
4-point resistance sensing
Special Cabling and Sample Carriers
High-voltage or high-frequency biasing options
High-voltage or high-frequency biasing options
EELS / EDS Compatible
Yes - full temperature range
Yes - full temperature range
TEM Compatibility
Thermo Fisher Scientific; JEOL; Hitachi
Thermo Fisher Scientific; JEOL; Hitachi
MEMS Chip Platform
Hummingbird Scientific in-house designed, fabricated, and tested MEMS chips
Hummingbird Scientific in-house designed, fabricated, and tested MEMS chips
Heating Control
Closed-loop control with on-chip sensor
Closed-loop control with on-chip sensor
Heating Control
Integrated heating and voltage source meter controller with GUI
Integrated heating and voltage source meter controller with GUI
Available Configurations
Single-tilt holder
High-accuracy double-tilt holder
Custom Configurations
Custom MEMS chips, sample carriers, cabling, high-voltage/high-frequency options
Custom MEMS chips, sample carriers, cabling, high-voltage/high-frequency options
Instrument Type
TEM
TEM

Available For:

Key Features and Capabilities

Custom Camera Integration Options

Evaluate camera/software integration options for specialized heating and biasing workflows.

Custom MEMS Chips and Sample Carriers

Adapt MEMS chip geometry, sample support, and contact layout for specialized in-situ TEM experiments.

High-Voltage or High-Frequency Biasing Options

Customize cabling and sample carriers for specialized high-voltage or high-frequency biasing experiments.

Integrated Heating and Biasing Control

Control temperature set points, heating, biasing, and voltage sweeps with an intuitive GUI.

In-House Microfabricated MEMS Chips

Use MEMS chips designed, fabricated, and tested by Hummingbird Scientific for heating and biasing workflows.

EELS and EDS Compatible

Correlate structural, chemical, and elemental information during high-temperature heating and biasing.

Accurate and Repeatable Double Tilt

Use high-accuracy beta tilt with <0.01 degree resolution and accuracy in the double-tilt configuration.

9-Contact Electrical Biasing

Apply electrical stimulus through 9 standard contacts with flexible heating-biasing operation.

High-Temperature MEMS Heating

Heat samples above 1000 °C with closed-loop MEMS heater control and on-chip sensing.

Direct Chip Contact MEMS Platform

Reliably connect to MEMS heating and biasing chips without fragile probe landing.

Advanced Configuration Options